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Production of prototypes and small runs
Production of prototypes and small runs
For one of our clients, we have prepared and assembled prototypes of three programmer models. The prototypes made it possible to carry out detailed tests and improve the design.
The client approved the finished design and commissioned the production of a small test series of programmers to check how the products would perform on the market.
Precise assembly
Precise assembly
At Spiketronics, we assemble 0201 and BGA/WLCSP/QFN elements with a pin spacing of up to 0.4 mm.
The size of the pads can be as low as 0.2 mm!
Multi-layer production
Multi-layer production
At Spiketronics, we install demanding electronics boards.
A high degree of packing or miniature integrated circuits such as BGA and QFN are not a problem for us.
Production testers
Production testers
At Spiketronics, we offer the possibility of testing electronic boards using advanced production instruments or classic testers.
Successful assembly of the highly integrated ESP32 PCB
Successful assembly of the highly integrated ESP32 PCB
The first mass production of the ESP32 module has been successfully completed.
The photo shows the end result.
Our assembly line does a perfect job!
The 3D model (available also at bigger resolution at https://www.3dvieweronline.com/members/Id7cdaf866427e1b0d08be0c6bdf6669d5/7qhUIh9YoMgVPd9) of the device and the assembled prototype.
3D modeling services at Spiketronics
3D modeling services at Spiketronics
To meet the expectations of our customers, we implemented additional 3D modeling services before assembly.
Condensation soldering
Condensation soldering
Spiketronics has implemented an innovative vapor phase soldering technology.
At Spiketronics, we solder with the innovative liquid polymer technology (perfluoropolyether - PFPE). It is a liquid that is chemically inert and has a density almost twice that of water.
One of the most important advantages of this method of soldering is the high surface tension and high thermal conductivity of the polymer, which, through condensation on the soldered electronic package, ensures very good coverage, and thus even heating of all critical places, such as BGA gaps, components located very close to each other, non-standard elements, of various sizes and the like.
Due to its high density, the liquid PFPE fraction displaces oxygen from the surface of the packet. As a result, we are dealing with a soldering process in an oxygen-free environment.
This technology is well suited for soldering prototypes and short runs of very complex or difficult-to-solder electronic packets, and the number of solder defects is usually lower compared to convection soldering.
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